For one-pack heat curing.
| Grade | Solids (wt%) |
NCO (wt%) |
Viscosity (mPa・s, 25°C) |
Solvents contained | Special properties | Temp. (°C) |
|
|---|---|---|---|---|---|---|---|
Hydrophobic |
MF-K60B | 60 | 6.5 | 220 | n-Butyl acetate n-Butyl alcohol |
Low-temp. curing Storage stability |
90~ |
| SBB-70P | 70 | 10.1 | 2,700 | PMA | Adhesion Low-temp.curing in thin film thickness |
110~ | |
| SBN-70D | 70 | 10.1 | 3,300 | DPM a | Low coloration Low-temp. curing in thin film thickness |
110~ | |
| TBN-75PS | 75 | 10.7 | 3,400 | PMA SN b |
Low coloration Low-temp. curing in thin film thickness |
110~ | |
| SBL-100 | 100 | 15.0 | 20,000 (60℃) |
— | Low coloration Low-temp. curing thin film thickness |
110~ | |
| MF-B60B | 60 | 8.0 | 250 | n-Butyl acetate n-Butyl alcohol |
Low-temp. curing Low coloration |
120~ | |
| 17B-60P | 60 | 9.5 | 500 | PMA | Adhesion | 130~ | |
| TPA-B80E | 80 | 12.5 | 1,800 | Ethyl acetate | Excellent weatherability |
130~ | |
| E402-B80B | 80 | 6.0 | 2,000 | n-Butyl acetate | Elasticity | 130~ | |
| Hydrophilic | WM44-L70G |
70 | 5.3 | 2,200 | DPDM c | Low-temp. curing Storage stability |
90~ |
a : Dipropyleneglycol monomethylether b : Solvent naphtha c : Dipropyleneglycol dimethylether
Coating gel fraction after 30 min baking
MF-K without catalyst; MF-B, TPA-B and SBN with catalyst
Curing windows, with polyol OHV = 100
Compared with caprolactum-blocked HDI trimer:Curing proceeds in regions above respective plotted lines
